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A. List of Publications


International Journals


1. Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han, Yong-Sung Eom and Young-Eui Shin, Self-organized interconnection process using solderable ACA (Anisotropic conductive adhesive), Materials Transactions Vol. 50, No. 7, pp. 1684-1689, 2009.


2. Byung-Seung Yim, Jong-Min Kim, Sung-Ho Jeon, Seong Hyuk Lee, Jooheon Kim, Jung-Geun Han and Minhaeng Cho, Hybrid interconnection process using solderable ICAs (Isotropic conductive adhesives) with low-melting-point alloy fillers, Materials Transactions Vol. 50, No. 11, pp. 2649-2655, 2009.


3. Byung-Seung Yim and Jong-Min Kim, Characteristics of isotropically conductive adhesive (ICA) filled with carbon nanotubes (CNTs) and low-melting-point alloy fillers, Materials Transactions Vol. 51, No. 7, pp. 2329-2331, 2010.


4. Yumi Kwon, Byung-Seung Yim, Jong-min Kim and Jooheon Kim, Mechanical and wetting properties of epoxy resins: amine-containing epoxy-terminated siloxane oligomer with or without reductant, Microelectronics Reliability Vol. 51, No. 4, pp. 819-825, 2011.


5. Yumi Kwon, Byung-Seung Yim, Jong-min Kim and Jooheon Kim, Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs), Microelectronics Reliability Vol. 51, No. 4, pp. 812-818, 2011.


6. Jiwon Kim, Byung-Seung Yim, Jong-min Kim and Jooheon Kim, The Effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs), Microelectronics Reliability Vol. 52, No. 3, pp. 595-602, 2012.


7. Byung-Seung Yim, Seung-Hoon Oh, Jiwon Kim, Jooheon Kim and Jong-Min Kim, Characteristics of graphene-filled solderable isotropically conductive adhesive (ICA), Materials Transactions Vol. 53, No. 3, pp. 578-581, February 2012.


8. Byung-Seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee and Jong-Min Kim, Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging, Microelectronics Reliability Vol. 52, No. 6, pp. 1165-1173, 2012.


9. Byung-Seung Yim, Jeong Il Lee, Yuseon Heo, Jooheon Kim, Seong Hyuk Lee, Young-Eui Shin and Jong-Min Kim, Reliability properties of solderable conductive adhesives with low-melting-point alloy fillers, Materials Transactions Vol. 53, No. 12, pp. 2104-2110, 2012.


10. Jin Sik Jeong, Byung-Seung Yim, Seung Hoon Oh, Hojin Song, Byung Hun Lee and Jong-Min Kim, Properties investigation on chip-on-film (COF) thermosonic bonding using anisotropic conductive films (ACFs), Materials Transactions Vol. 53, No. 12, pp. 2097-2103, 2012.


11. Byung-Seung Yim, Seung Hoon Oh, Jin Sik Jeong and Jong-Min Kim, Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers, Journal of Composite Materials Vol. 47, No. 9, pp. 1141-1152, 2013.


12. Byung-Seung Yim, Byung Hun Lee, Jooheon Kim and Jong-Min Kim, Effect of dispersion condition of multi-walled carbon nanotude (MWNT) on bonding properties of solderable ICAs, Journal of Materials Science: Materials in Electronics, Vol. 25, No. 12, pp. 5208-5217, 2014.


13. Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Young-Eui Shin and Jong-Min Kim, An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler, Microelectronics Reliability, Vol. 54, No. 12, pp. 2944-2950, 2014.


14. Byung-Seung Yim and Jong-Min Kim, Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites, Journal of Materials Science: Materials in Electronics, Vol. 26, No. 3, pp. 1678-1689, 2015.


15. Byung-Seung Yim, Jeong Il Lee, Byung Hun Lee, Yong-Eui Shin and Jong-Min Kim, Bonding characteristics of underfilled ball grid array packaging, Materials Transactions, Vol. 56, No. 7, pp. 974-980, 2015.


16. Byung-Seung Yim and Jong-Min Kim, Influence of the multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs), Journal of Materials Science: Materials in Electronics, Vol. 26, No. 7, pp. 4969-4980, 2015.


17. Jeong Il Lee, Byung-Seung Yim, Mu Seong Yun and Jong-Min Kim, Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers, Journal of Materials Science: Materials in Electronics, Vol. 27, No. 1, pp. 982-991, 2016.


18. Byung-Seung Yim and Jong-Min Kim, Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive, Microelectronics Reliability, Vol. 57, No. 1, pp. 93-100, 2016.


19. Byung-Seung Yim, Kiho Kim, Jooheon Kim and Jong-Min Kim, Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives, Journal of Materials Science: Materials in Electronics, Vol. 27, No. 5, pp. 4516-4525, 2016.


20. Jeong Il Lee, Byung-Seung Yim, Dongjun Shin and Jong-Min Kim, Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers, Journal of Materials Science: Materials in Electronics, Vol. 27, No. 6, pp. 6223-6231, 2016.


21. Byung-Seung Yim and Jong-Min Kim, Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites, Journal of Materials Science: Materials in Electronics, Vol. 27, No. 9, pp. 9159-9171, 2016.


22. Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim, Ball grid array interconnection properties of solderable polymer–solder composites with low-melting-point alloy fillers, Journal of Electronic Packaging, Vol. 139, No. 4, pp. 041007, 2017.


23. Byung-Seung Yim, Jeong Il Lee and Jong-Min Kim, Influence of reductant concentration on the conduction path formation properties of solderable polymer composites, Materials Transactions, Vol. 59, No. 9, pp. 1528-1531, 2018.


24. Byung-Seung Yim, Young-Eui Shin and Jong-Min Kim, Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs), Microelectronics Reliability, Vol. 91, No. 2, pp. 201-212, 2018.


25. Sangil Kim, Jong-Chul Yon and Byung-Seung Yim, Characteristics of suppression of flow-induced vibration of a test cylinder varied by installation of a control cylinder, Journal of Mechanical Science and Technology, Vol. 32, No. 12, pp. 5685-5696, 2018.


26. Byung-Seung Yim, Jae Woo Lee and Jong-Min Kim, Conduction path formation mechanism of solderable polymer composites with low-melting-point alloy/high-melting-point alloy mixed filler, Materials Transactions, Vol. 61, No. 3, pp. 557-560, 2020.


27. Hee Jun Youn, Jeong Il Lee, Jong-Min Kim and Byung-Seung Yim, Interconnection mechanism of Ni-reinforcement particle filled solderable polymer composites with low-melting-point alloy filler, Materials Transactions, Vol. 61, No. 12, pp. 2442-2445, 2020.


28. Jeong Il Lee, Byung-Seung Yim and Jong-Min Kim, Effect of dissolved-gas concentration on bulk nanobubbles generation using ultrasonication, Scientific Reports, Vol. 10, pp. 18816, 2020.


Domestic Journals


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7. Ӻ, , , Solderable ȯ ձ ŵ ġ , ѿȸ 37, 76-81, 2019.


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9. Ӻ, , , , ź Ʃ Solderable 漺 ̹漺 Ư ȭ ġ , ѿȸ 38, 152-157, 2020.


B. List of Proceedings


International Proceedings


1. Jin Suk Park, Sung-Ho Jeon, Sun Byung Lee, Byung-Seung Yim, Jong-Min Kim, Seong Hyuk Lee and Young-Eui Shin, Thermosonic chip on glass (COG) bonding with anisotropic conductive films (ACFs), Interfinish 2008, Busan, Korea, 374, 2008.06.16-06.19.


2. Jin Woon Lee, Byung-Seung Yim, Seong Hyuk Lee and Jong-Min Kim, Numerical investigation on coalescence and characteristics of isotropic conductive adhesives with low melting point alloy fillers, Interfinish 2008, Busan, Korea, 186, 2008.06.16-06.19.


3. Hyomi Kim, Byung-Seung Yim, Jong-Min Kim and Jooheon Kim, Curing kinetics of siloxane based epoxy binder for anisotropic conductive film, Interfinish 2008, Busan, Korea, 363, 2008.06.16-06.19.


4. Byung-Seung Yim, Sung-Ho Jeon, Hyomi Kim, Jin Woon Lee, Jooheon Kim, Seong Hyuk Lee and Jong-Min Kim, Wetting behavior of solder particle in solder filled electrically conductive adhesives (ECAs), Interfinish 2008, Busan, Korea, 372, 2008.06.16-06.19.


5. Hyun Seok Chung, Byung-Seung Yim, SeongMock Lee, Jung-Geun Han and Jong-Min Kim, Design and oscillation characteristics of ultrasonic transducers, Interfinish 2008, Busan, Korea, 373, 2008.06.16-06.19.


6. Byung-Seung Yim, Yong Song, Jin Sik Jeong, Yumi Kwon, Jooheon Kim and Jong-Min Kim, The self-organized characteristics of carbon nanotube (CNT)-filled solderable electrically conductive adhesive (ECA), 12th International Conference on Electronics Materials and Packaging (EMAP2010), Singapore, Singapore, 202, 2010.10.25-10-27.


7. Byung-Seung Yim, Seung Hoon Oh, Jeong Il Lee, Byung Hun Lee and Jong-Min Kim, Interconnection properties of carbon nanotube (CNT)-filled solderable isotropic and anisotropic conductive adhesives, 67th International Institute of Welding (IIW2014), Seoul, Korea, 2014.07.17-07.18.


Domestic Proceedings


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